TABLE OF CONTENTS
1. SCOPE ......................................................................................................................................... 1
1.1 Purpose ........................................................................................................................... 1
1.2 Reference Documents .................................................................................................... 1
1.2.1 Automotive ......................................................................................................... 1
1.2.2 Military ................................................................................................................ 2
1.2.3 Industrial ............................................................................................................. 2
1.3 Definitions ....................................................................................................................... 2
1.3.1 AEC Q100 Qualification ..................................................................................... 2
1.3.2 AEC Certification ................................................................................................ 2
1.3.3 Approval for Use in an Application ..................................................................... 2
1.3.4 Definition of Part Operating Temperature Grade ............................................... 3
1.3.5 Capability Measures Cpk ................................................................................... 3
1.3.6 Flip-Chip Ball Grid Array (FC-BGA) Package Configuration ............................. 3
2. GENERAL REQUIREMENTS ...................................................................................................... 4
2.1 Objective ......................................................................................................................... 4
2.1.1 Zero Defects ....................................................................................................... 4
2.2 Precedence of Requirements ......................................................................................... 4
2.3 Customer Specific Lifetime Requirements (Mission Profiles) ......................................... 4
2.4 Use of Generic Data to Satisfy Qualification and Requalification Requirements ........... 4
2.4.1 Definition of Generic Data .................................................................................. 4
2.4.2 Time Limit for Acceptance of Generic Data ....................................................... 5
2.5 Test Samples .................................................................................................................. 5
2.5.1 Lot Requirements ............................................................................................... 5
2.5.2 Production Requirements .................................................................................. 6
2.5.3 Reusability of Test Samples .............................................................................. 6
2.5.4 Sample Size Requirements ............................................................................... 6
2.5.5 Pre- and Post-stress Test Requirements ........................................................... 6
2.6 Definition of Test Failure After Stressing ........................................................................ 6
3. QUALIFICATION AND REQUALIFICATION ............................................................................... 6
3.1 Qualification of a New Device ......................................................................................... 6
3.2 Requalification of a Changed Device .............................................................................. 7
3.2.1 Process Change Notification .............................................................................. 7
3.2.2 Changes Requiring Requalification.................................................................... 7
3.3 Criteria for Passing Qualification and Requalification ..................................................... 7
3.4 User Approval ................................................................................................................. 7
3.5 Qualification of a Pb-Free Device ................................................................................... 7
3.6 Qualification of a Device Using Copper (Cu) Wire Interconnects ................................... 7
4. QUALIFICATION TESTS ............................................................................................................. 8
4.1 General Tests .................................................................................................................. 8
4.2 Device Specific Tests ...................................................................................................... 8
4.3 Wearout Reliability Tests ................................................................................................ 8
Appendix 1: Definition of a Product Qualification Family ......................................................................... 20
Appendix 2: Q100 Certification of Design, Construction and Qualification .............................................. 26
Appendix 3: Plastic Package Opening for Wire Bond Testing ................................................................. 29
Appendix 4: Minimum Requirements for Qualification Plans and Results ............................................... 30
Appendix 5: Part Design Criteria to Determine Need for EMC Testing ................................................... 35
Appendix 6: Part Design Criteria to Determine Need for SER Testing .................................................... 36
Appendix 7: AEC-Q100 and the Use of Mission Profiles .......................................................................... 37
Revision History ........................................................................................................................................ 44
